; environment to which the assembly is exposed. These two factors (each composed of severam variables i.e. assembly thermal expansion coefficients, elastic moduli of assembly members, maximum operating temperature, rate of temperature change, etc.) boil down to three critical CO parameters; temperature, strain

The greatest concern regarding reliability of solder joints is thermomechanical fatigue (TMF). TMF results from constrained temperature changes in the environment of the electronic package and/or temperature gradients induced by power cycling of the package. Typically, electronic packages

No-clean solder paste formulations have been directed toward reducing residue after reflow, placing more emphasis on the need for tighter control of the printing and reflow environment. In qualifylng a solder paste for PCB assembly, the test program should include evaluations of risk to product

product. Major factors that can create variation in a lead free process were identified, including lead free solder paste brand, paste print speed, oven reflow temperatures and times, and reflow environment. Several noise factors were studied including volume of solder paste, location of components

Abstract. Structural analysis of web pages has been proposed several times and for a number of reasons and purposes, such as the re-flowing of standard web pages to fit a smaller PDA screen. elISA is a rule-based system for the analysis of regularities and structures within web pages that is used

electronic product. Conductive anodic filament (CAF) formation is a failure mode associated with boards, which either operate or are stored in a humid envi-ronment. This paper compares the number of CAF formed on boards reflowed at 201°C vs. 241°C after aging under 100V bias at 85°C/85 % RH for 28 days

The reality of today’s economic environment is that many companies rely on Sub-contractors and are forced to “Uprate ” commercially available devices. The problem is; “How can you confirm that you are getting what you paid for? ” This is especially true for quality and reliability issues

Abstract — Plastic electronic packages are known to absorb moisture when exposed to humid ambient conditions during storage in tape and reel in the factory. Reliability becomes a concern when packages are exposed to a humid environment for a prolonged time and then processed through a reflow oven

Lead-free solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz high-frequency thermosonic bonding method is proposed and realized using a lab bonder

with view changes, we compared user performance with a spatially-stable presentation (using scaling) with that of a ‘reflowing ’ presentation (widely used in current interfaces). This study showed that spatial stability with scaling dramatically outperforms reflowing. This research provides new evidence