to the battery, saving the use of an LDO. This device is available in a 9−Pin Flip−Chip CSP (standard Tin−Lead and Lead−Free versions) and a Micro8 � package.

power supply. The NCP2991 provides high quality audio while requiring few external components and minimal power consumption. It features a low−power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP2991 contains circuitry to prevent from “pop and click

supply. The NCP2993 provides high quality audio while requiring few external components and minimal power consumption. It features a low−power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP2993 contains circuitry to prevent from “pop and click” noise

The NLX1G99 MiniGate � is an advanced high−speed CMOS multifunction gate with a 3−state output. With the output enable input (OE) at High, the output is disabled and is kept at high impedance. With the output enable input (OE) at Low, the device can be configured for logic functions such as MUX, AND, OR, NAND, NOR, XOR, XNOR, INVERT and BUFFER, depending on the combination of the 4−bit input. The device has Schmitt−trigger inputs, thereby enhancing noise immunity. The NLX1G99 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage.

Information HIII51012-3.1

The NLSV4T240 is a 4-bit configurable dual-supply voltage level translator. The input An and output Bn ports are designed to track two different power supply rails, VCCA and VCCB respectively. Both supply rails are configurable from 0.9 V to 4.5 V allowing universal low-voltage translation from the input An to the output Bn port.

, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3−pin TO-92, micro size

silicon chips attached with epoxy resin to substrates having gold or other metal surfaces. In severe cases, the bleeding contaminates the wire bond pads, causing failure. The effects of bleeding are often critical in advanced packaging components such as ceramic pin grid array (CPGA) substrates

Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the full handbook.

Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the full handbook.