Tools
Sorted by:
Try your query at:
 |
 |
 |
 |
 |
 |
Results 1 - 10
of
38
Processing Guidelines The IPC Standard IPC-SF-818 outlines
"... No-clean solder paste formulations have been directed toward reducing residue after reflow, placing more emphasis on the need for tighter control of the printing and reflow environment. In qualifylng a solder paste for PCB assembly, the test program should include evaluations of risk to product reli ..."
Abstract
- Add to MetaCart
No-clean solder paste formulations have been directed toward reducing residue after reflow, placing more emphasis on the need for tighter control of the printing and reflow environment. In qualifylng a solder paste for PCB assembly, the test program should include evaluations of risk to product
Precision Application of No-Clean Fluxes
"... he no-clean manufacturing process involves several interrelated process steps. These steps include receiving a clean PCB; surface-mount paste screening, placement and reflow; throughhole component placement; flux application; and wave soldering. This article will focus on the application of flux to ..."
Abstract
- Add to MetaCart
he no-clean manufacturing process involves several interrelated process steps. These steps include receiving a clean PCB; surface-mount paste screening, placement and reflow; throughhole component placement; flux application; and wave soldering. This article will focus on the application of flux
Product Information Indium8.9 No-Clean Pb-Free Solder Paste Features
"... • �Low voiding at via-in-pad ..."
k6~i4+ No-Clean Reflow po I= Process Implementat ion
"... ne of the corporate goals at AT&T is to eliminate chloroflurocarbons (CFCs) from its manufacturing operations by the end of 1994. Many alternatives have been implemented to meet this objective, including noclean wave soldering using low-solids flux, aqueous cleaning of water-soluble flux, aqueou ..."
Abstract
- Add to MetaCart
, aqueous cleaning with saponifiers and semiaqueous (terpene) cleaning. Part 1 of this article describes the development of a noclean reflow soldering process using low-residue solder paste (LRSP).
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
"... The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fine-pitch components assembly processes. Moreover, halogen-free is another new requirement for assembled PCB ..."
Abstract
- Add to MetaCart
activator system was developed recently for solder paste flux, tacky flux and liquid flux formulation. This paper will discuss three Type 4 lead-free halogen-free no-clean solder pastes (ROL0) developed based on different innovative activators, which respond to the challenges described above. The printing
1 Formulation Considerations for Automated Dispensing of Lead Free Solder Paste
"... Dispensing solder paste with automated dispensing equipment provides many challenges that must be overcome before a production process can be considered robust. The primary challenge to overcome is the tendency for solder paste to plug in dispensing pumps and needles. This paper outlines the importa ..."
Abstract
- Add to MetaCart
the important process parameters that must be determined and controlled for good production robustness, including the selection of valve or pump technology, selection of dispensing needles, selection of solder paste packaging, generic equipment settings, and paste formulation. In particular, the effect
Experimental Study of a Solder Paste Stenciling Process Using Factorial Design
"... A solder paste stenciling process is investigated with fractional factorial experiments. The squeegee cleaning frequency and the paste temperature are found to be significantly affecting the printed solder paste quality, as measured by the percentage volume matching (PVM) and the non-conformities pe ..."
Abstract
- Add to MetaCart
A solder paste stenciling process is investigated with fractional factorial experiments. The squeegee cleaning frequency and the paste temperature are found to be significantly affecting the printed solder paste quality, as measured by the percentage volume matching (PVM) and the non
I 4 I
"... Addressing the no-clean option for those situations where cleaning is currently considered necessary, and where CFC solvent usage must be reduced or eliminated. By Dr. Wallace Rubin and Dr. Malcolm Warwick, Multicore Solders Ltd., Westbury, N.Y. The use of no-clean fluxes in liquid and solid form ha ..."
Abstract
- Add to MetaCart
has grown considerably primarily for two reasons: to reduce costs and to minimize the environmental impact of soldering operations. At the same time, considerable work is progressing on no-clean fluxes for solder pastes. In order to build confidence in the technology, it is essential to
and
"... The thrust toward elimination of ' CFC's has created a need for new solder pastes which do not require solvent cleaning. Water soluble and low residue pastes are new alternatives; maintaining the status quo and not cleaning the residue is another alternative. This paper will focus on the l ..."
Abstract
- Add to MetaCart
with noclean pastes and fluxes. Two candidates were chosen as suitable and are currently in the process of being introduced in the Toronto manufacturing facility, This paper summarizes the evaluations performed in introducing a no-clean paste and no-clean flux into the manufacturing process, and the associated
Can Existing Tools Survive Pb-Free Soldering?
, 2005
"... Most machines pass the test, but some key changes are ahead. In the transition to lead-free soldering, an area of concern in assembly operations is what equipment changes, if any, will be needed for lead-free electronics assembly processes. SnAgCu (or SAC), the most common lead-free solder alloy, ha ..."
Abstract
- Add to MetaCart
for paste printing can also be used for Pb-free printing. Older Pb-free solder paste formulations often required the use of slower printer speeds with higher print pressures because of the non-optimized flow characteristics of the pastes. However, improvements in Pb-free solders have optimized the metal
Results 1 - 10
of
38
