Results 1 - 10 of 6,734

Habitat monitoring: application driver for wireless communications technology

by Alberto Cerpa, Jeremy Elson, Deborah Estrin, Lewis Girod - In ACM SIGCOMM Workshop on Data Communications in Latin America and the Caribbean , 2001
"... lecs.cs.ucla.edu As new fabrication and integration technologies reduce the cost and size of micro-sensors and wireless interfaces, it becomes feasible to deploy densely distributed wireless networks of sensors and actuators. These systems promise to revolutionize biological, earth, and environmenta ..."
Abstract - Cited by 424 (39 self) - Add to MetaCart
lecs.cs.ucla.edu As new fabrication and integration technologies reduce the cost and size of micro-sensors and wireless interfaces, it becomes feasible to deploy densely distributed wireless networks of sensors and actuators. These systems promise to revolutionize biological, earth

NEW FABRICATION METHOD OF THREE-ELECTRODE

by Zhuoqing Yang, Yi Zhang, Ryutaro Maeda, See Profile , 2013
"... All in-text references underlined in blue are linked to publications on ResearchGate, letting you access and read them immediately. ..."
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All in-text references underlined in blue are linked to publications on ResearchGate, letting you access and read them immediately.

A NEW FABRICATION AND STIFFENING METHOD OF SRF CAVITIES

by unknown authors
"... ABSTRACT A new fabrication and stiffening method of SRF cavities is proposed. The principle is to spray a copper layer onto a thin wall niobium cavity. The main advantages of this technique are fabrication cost re-duction and stiffening method simplification. Numerical simulations were performed to ..."
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ABSTRACT A new fabrication and stiffening method of SRF cavities is proposed. The principle is to spray a copper layer onto a thin wall niobium cavity. The main advantages of this technique are fabrication cost re-duction and stiffening method simplification. Numerical simulations were performed

DIVA: A Reliable Substrate for Deep Submicron Microarchitecture Design

by Todd M. Austin - In Proc. 32nd Annual Intl. Symp. on Microarchitecture , 1999
"... Building a high-petformance microprocessor presents many reliability challenges. Designers must verify the correctness of large complex systems and construct implementations that work reliably in varied (and occasionally adverse) operating conditions. To&rther complicate this task, deep submicro ..."
Abstract - Cited by 374 (15 self) - Add to MetaCart
submicron fabrication technologies present new reliability challenges in the form of degraded signal quality and logic failures caused by natural radiation interference. In this paper; we introduce dynamic verification, a novel microarchitectural technique that can significantly reduce the burden

Weaving a New Fabric of Natural History

by Antal Van Den Bosch, Piroska Lendvai, Marieke Van, Steve Hunt
"... Natural history offers an interestingly rich mix of traditional and modern ways of organizing data, information, and knowledge. The Linnaean tradition still defi nes the basis of how taxonomic knowledge of organisms is organized, while at the same time complementary perspectives on databases and ont ..."
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, which is generally more noisy and ambiguous than numeric data. In this contribution, we present two methods for the automated discovery of metadata from textual object databases: fi rst, the automatic detection of new metadata in existing free-text database columns, and second, the discovery of new

The Raw Microprocessor: A Computational Fabric for Software Circuits and General-Purpose Programs

by Michael Taylor, Michael Bedford Taylor, Jason Kim, Jason Miller, David Wentzlaff, Fae Ghodrat, Ben Greenwald, Henry Hoffman, Paul Johnson, Jae-wook Lee, Walter Lee, Albert Ma, Arvind Saraf, Mark Seneski, Nathan Shnidman, Volker Strumpen, Matthew Frank, Saman Amarasinghe, Anant Agarwal , 2002
"... Wire Delay is emerging as the natural limiter to microprocessor scalability. A new architectural approach could solve this problem... ..."
Abstract - Cited by 251 (22 self) - Add to MetaCart
Wire Delay is emerging as the natural limiter to microprocessor scalability. A new architectural approach could solve this problem...

A NEW FABRICATION TECHNIQUE FOR INTEGRATING SILICA OPTICAL DEVICES AND MEMS

by Karen E. Grutter, Anthony M. Yeh, Susant K. Patra, Ming C. Wu
"... We have developed a novel fabrication process which integrates silicon MEMS actuators with silica optical components. Suspended silica optical waveguides are actuated by a silicon electrostatic comb drive actuator, with a maximum displacement of 8µm at 35V bias. ..."
Abstract - Cited by 1 (1 self) - Add to MetaCart
We have developed a novel fabrication process which integrates silicon MEMS actuators with silica optical components. Suspended silica optical waveguides are actuated by a silicon electrostatic comb drive actuator, with a maximum displacement of 8µm at 35V bias.

Nanoskiving Core−Shell Nanowires: A New Fabrication Method for Nano-optics

by Douglas C. Watson, Ramses V. Martinez, Yannik Fontana, Eleonora Russo-averchi, Martin Heiss, Anna Fontcuberta I Morral, George M. Whitesides
"... ABSTRACT: This paper describes the fabrication of functional optical devices by sectioning quantum-dot-in-nanowires systems with predefined lengths and orientations. This fabrication process requires only two steps, embedding the nanowires in epoxy and using an ultramicrotome to section them across ..."
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ABSTRACT: This paper describes the fabrication of functional optical devices by sectioning quantum-dot-in-nanowires systems with predefined lengths and orientations. This fabrication process requires only two steps, embedding the nanowires in epoxy and using an ultramicrotome to section them across

Direct wafer bonding: A new fabrication method for ferroelectric-silicon heterostructures

by M. Alexe, R. Scholz, G. Kastner, A. Pignolet, U Gosele
"... Abstract. Ferroelectric-semiconductor heterostructures were fabricated using direct wafer bonding. Polycrystalline Bi4Ti3012 ferroelectric thin films were deposited on 3 " silicon wafers by chemical solution deposition. The films were polished and then directly bonded to silicon wafers in a mic ..."
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Abstract. Ferroelectric-semiconductor heterostructures were fabricated using direct wafer bonding. Polycrystalline Bi4Ti3012 ferroelectric thin films were deposited on 3 " silicon wafers by chemical solution deposition. The films were polished and then directly bonded to silicon wafers in a

1Increased Flexural Modulus and Strength in SWNT / Epoxy Composites by a New Fabrication Method

by Mohammad Moniruzzaman, Fangming Du, Naiffer Romero, Karen I. Winey, Mohammad Moniruzzamana, Fangming Dub, Naiffer Romeroa, Karen I , 2006
"... by a New Fabrication Method A new method for preparing SWNT/epoxy nanocomposites has been developed which involves high shear mixing of the epoxy resin and SWNT and heat treating the mixture prior to introducing the hardener. The glass transition temperature of the epoxy resin is unaffected by the p ..."
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by a New Fabrication Method A new method for preparing SWNT/epoxy nanocomposites has been developed which involves high shear mixing of the epoxy resin and SWNT and heat treating the mixture prior to introducing the hardener. The glass transition temperature of the epoxy resin is unaffected
Results 1 - 10 of 6,734