important in the semiconductor in-dustry due to the shrinking of micro- and nano-scale devices. Such uncertainties have led to remarkable performance variations at both circuit and system levels, and they cannot be ignored any more in the design of nano-scale integrated circuits and mi-croelectromechanical

A quantitative model capturing pattern density effects in Deep Reactive Ion Etch (DRIE), which are important in MEMS, is presented. Our previous work has explored the causes of wafer-level variation and demonstrated die-to-die interactions resulting from pattern density and reactant species consumption. Several reports have focused on experimental evidence and modeling of feature level (aspect ratio) dependencies. This thesis contributes a computationally efficient and effective modeling approach which focuses on layout pattern density-induced nonuniformity in DRIE. This is a key component in an integrated model combining wafer-, die-, and feature-level DRIE dependencies to predict etch depth for an input layout and a characterized etch tool and process. The modeling approach proposed here is inspired by previous work in modeling of chemical mechanical polishing (CMP). Computationally, this involves the convolution of an etch "layout impulse response " function or filter with the layout information (or equivalently but more efficiently the multiplication of FFTs). The proposed model is validated by using a mask layer from the MIT

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few years and its application to batch fabrication of micromechanisms and of monolithic microelectromechanical systems (MEMS) make a thorough review of surface micromachining appropriate at this time. Four central issues of consequence to the MEMS technologist are: i) the understanding and control

: A method for simulation of microelectromechanical systems is presented. It is based on usage of behavioural simulators and their hardware description languages. Behaviour of a micromachined sensor can be described in such language. For the first time, partial differential equations are used

of microelectromechanical systems and even lead to an invalid system. Key Words: Microelectromechanical systems, micromachined switch, nonlinear of electrostatic, bifurcation and chaos

Piezoelectric micromirror array is developed based on microelectromechanical systems (MEMS) technology. The inherent coupled nature of the thin-film processes generates many problems unless the design of the microactuator is properly uncoupled or decoupled among the functional domain, the physical

Microelectromechanical systems (MEMS) are ubiquitous. Scalable large-area ar-rays of MEMS on a variety of substrates, including flexible substrates, have many potential applications. Novel methods for additive fabrication of thin (125±15 nm thick) suspended gold membranes on a variety of rigid

An overview of recent progress in the research and development of microelectromechanical devices for use in wireless communication sub-systems is presented. Among the specific devices described are tunable micromachined capacitors, integrated high-Q inductors, low loss micromechanical switches