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Benefit of ArF immersion lithography in 55 nm logic device manufacturing
"... ABSTRACT In this paper we demonstrate the many benefits of using immersion lithography that go beyond depth of focus (DOF) improvement by comparing several key features of dry and immersion lithography. Immersion lithography improves critical dimension uniformity (CDU) as well as avoiding the neces ..."
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of immersion lithography in mass production. Now these challenges have been met for the manufacturing requirements of 55 nm logic devices. The achievements of immersion lithography include overlay accuracy within 10 nm on resist-to-resist wafers and within 20 nm on production wafers, fewer than 10 defects per
Benefit of ArF immersion lithography in 55 nm logic device manufacturing
"... In this paper we demonstrate the many benefits of using immersion lithography that go beyond depth of focus (DOF) improvement by comparing several key features of dry and immersion lithography. Immersion lithography improves critical dimension uniformity (CDU) as well as avoiding the necessity for s ..."
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of immersion lithography in mass production. Now these challenges have been met for the manufacturing requirements of 55 nm logic devices. The achievements of immersion lithography include overlay accuracy within 10 nm on resist-to-resist wafers and within 20 nm on production wafers, fewer than 10 defects per
Process optimisation in pulsed laser micromachining with applications in medical device manufacturing
- Int. J. Advd Mfg Technol
"... ..."
A Neutron Activation Analysis Study of the Sources of Transition Group Metal Contamination in the Silicon Device Manufacturing Process
"... A survey is given of the sources, species, and quantities of transition group metals residing on starting silicon substrates and introduced uring the device manufacturing process. The survey begins with the polysilicon feed for silicon ingot fabrication and extends through all customary device fabri ..."
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A survey is given of the sources, species, and quantities of transition group metals residing on starting silicon substrates and introduced uring the device manufacturing process. The survey begins with the polysilicon feed for silicon ingot fabrication and extends through all customary device
MSEC2008-72202 DESIGN AND FABRICATION OF A ROLLER IMPRINTING DEVICE FOR MICROFLUIDIC DEVICE MANUFACTURING
"... ABSTRACT Microfluidic devices are gaining popularity in a variety of applications, ranging from molecular biology to bio-defense. However, the widespread adoption of this technology is constrained by the lack of efficient and cost-effective manufacturing processes. This paper focuses on the roller ..."
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ABSTRACT Microfluidic devices are gaining popularity in a variety of applications, ranging from molecular biology to bio-defense. However, the widespread adoption of this technology is constrained by the lack of efficient and cost-effective manufacturing processes. This paper focuses on the roller
Manufacturing in MEMS Applications VTT PUBLICATIONS 611 Advanced CMP Processes for Special Substrates and for Device Manufacturing in MEMS Applications
"... Engineering, for public examination and debate in the large Seminar room at VTT Micronova (Espoo, Finland) on Friday ..."
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Engineering, for public examination and debate in the large Seminar room at VTT Micronova (Espoo, Finland) on Friday
Business Method Patents in Europe and their Strategic Use – Evidence from Franking Device Manufacturers
- Economics of Innovation and New Technology
"... There has been a wide-spread misconception based on the impre-cise wording of Art. 52 of the European Patent Convention (EPC) that the protection of business methods by patents is prohibited in Europe. This paper investigates the legal framework set by patent laws with respect to the patentability o ..."
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Cited by 15 (0 self)
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and major patent indicators are computed. Further, a case study from the franking device industry which is characterized by strong competi-tion for intellectual property rights is conducted. It contains evidence for the strategic use of business method patents leading to opposition rates against granted
A Fracture-Mechanics-Based Approach to Fracture Control in Biomedical Devices Manufactured From Superelastic Nitinol Tube
, 2007
"... Abstract: Several key fracture-mechanics parameters associated with the onset of subcritical and critical cracking, specifically the fracture toughness, crack-resistance curve, and fatigue threshold, have recently been reported for the superelastic alloy Nitinol, in the product form of the thin-wall ..."
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Cited by 3 (1 self)
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-walled tube that is used to manufacture several biomedical devices, most notably endovascular stents. In this study, we use these critical parameters to construct simple decision criteria for assessing the quantitative effect of crack-like defects in such Nitinol devices with respect to their resistance
Study for plasma etching of dielectric film in semiconductor device manufacturing. Review of ASET research project*
"... Abstract: Conventional developments were conducted in a very empirical way, such as a trial and error with many speculations using qualitative data. This approach requires more and more resources and time for the development of future devices with a design rule below 100 nm in the system on a chip ( ..."
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Abstract: Conventional developments were conducted in a very empirical way, such as a trial and error with many speculations using qualitative data. This approach requires more and more resources and time for the development of future devices with a design rule below 100 nm in the system on a chip
Results 11 - 20
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5,297
