D. Cottet, J. Grzyb, G. Trster Electronics Lab, ETH Zrich Gloriastrasse 35,...  Home/Search
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Abstract: A new low cost thin film substrate technology was developed within the EU research project LAP. The project's substrate cost target of 1 US$/inch 2 shall be obtained by using low cost materials and large area panel processing (LAP). This paper presents tests and measurements showing the process accuracy and the geometric variations resulting from low cost manufacturing. The second part is focusing on the impact on RF structure integration and on partitioning aspects for RF chip-package... (Update)
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BibTeX entry: (Update)
D. Cottet, J. Grzyb, G. Trster, "The impact of low cost high density substrates on RF structure integration", in Proc. Second Int. Workshop on Chip-Package Co-Design (CPD http://citeseer.ist.psu.edu/cottet00impact.html More
@misc{ cottet-impact,
author = "D. Cottet and J. Grzyb and G. Trster",
title = "The impact of low cost high density substrates on RF structure integration",
text = "D. Cottet, J. Grzyb, G. Trster, The impact of low cost high density substrates
on RF structure integration, in Proc. Second Int. Workshop on Chip-Package
Co-Design (CPD",
url = "citeseer.ist.psu.edu/cottet00impact.html" }
Citations (may not include all citations):4 Multilayer planarization of polymer dielectrics (context) - Chiniwalla - 1999
3 Low cost large area panel processing of MCM-D substrates and.. (context) - project - 1998
3 RF characterization of low cost MCM-D substrates, manufactur.. - Cottet, Scheffler et al. - 1999
1 Properties of thin film polyimide films (context) - Rothman - 1980
1 Electrical design and simulation of high density printed cir.. (context) - Swirbel, Naujoks et al. - 1999
1 A review of the skin effect as applied to thin film intercon.. (context) - Hwang, Turlik - 1992
1 Lossy substrate and resonance analysis of embedded inductors (context) - Zhao, Dai et al. - 1998
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