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Abstract: A new low cost thin film substrate technology was developed within the EU research project LAP. The project's substrate cost target of 1 US$/inch 2 shall be obtained by using low cost materials and large area panel processing (LAP). This paper presents tests and measurements showing the process accuracy and the geometric variations resulting from low cost manufacturing. The second part is focusing on the impact on RF structure integration and on partitioning aspects for RF chip-package... (Update)
Context of citations to this paper: More
...costs. One big difference when moving from small to large panels is that the process variations within one panel are no longer uniform [2]. At the edge of a large panel, for example, the etchant concentration is usually higher than in the centre. This results in an...
...x 24 inch 2 panels. Detailed investigations on the LAP process tolerances and a discussion on their impact on RF structure design is reported in [3]. Fig. 1: Impedance profiles of microstrip lines Fig. 2: S 21 of the 50 W microstrip lines 1 2 6 5 3 4 7 8 9 10 Fig. 3: RF TV1 Fig....
Cited by: More
Integrated Rf Components On Low Cost Mcm-D Substrates - Cottet, Grzyb, Scheffler, .. (Correct)
New Process Monitoring Strategies for Large Area Panel.. - Didier Cottet Michael (2000) (Correct)
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0.6: Experimental Analysis of Design Options for Spiral.. - Didier Cottet Janusz (2001) (Correct)
0.2: MM-Wave Integrated Antennas on Low Cost MCM-D Substrates - Janusz Grzyb Didier (2000) (Correct)
0.2: Distributed Elements and MM-Wave Characterization of Low.. - Grzyb, Cottet, Tröster (2001) (Correct)
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0.7: Lap: Low Cost Large Area Panel Processing Of . . . - Scheffler, al. (2001) (Correct)
0.7: Integrated Passive Elements on Low Cost MCM-D Substrates - Grzyb, Cottet, Tröster (2001) (Correct)
0.7: On LAP Process Tolerances and their Impact on Cost and RF .. - Michael Scheffler Didier (2001) (Correct)
BibTeX entry: (Update)
D. Cottet, J. Grzyb, G. Trster, "The impact of low cost high density substrates on RF structure integration", in Proc. Second Int. Workshop on Chip-Package Co-Design (CPD http://citeseer.ist.psu.edu/cottet00impact.html More
@misc{ cottet-impact,
author = "D. Cottet and J. Grzyb and G. Trster",
title = "The impact of low cost high density substrates on RF structure integration",
text = "D. Cottet, J. Grzyb, G. Trster, The impact of low cost high density substrates
on RF structure integration, in Proc. Second Int. Workshop on Chip-Package
Co-Design (CPD",
url = "citeseer.ist.psu.edu/cottet00impact.html" }
Citations (may not include all citations):4 Multilayer planarization of polymer dielectrics (context) - Chiniwalla - 1999
3 Low cost large area panel processing of MCM-D substrates and.. (context) - project - 1998
3 RF characterization of low cost MCM-D substrates, manufactur.. - Cottet, Scheffler et al. - 1999
1 Properties of thin film polyimide films (context) - Rothman - 1980
1 Electrical design and simulation of high density printed cir.. (context) - Swirbel, Naujoks et al. - 1999
1 A review of the skin effect as applied to thin film intercon.. (context) - Hwang, Turlik - 1992
1 Lossy substrate and resonance analysis of embedded inductors (context) - Zhao, Dai et al. - 1998
Documents on the same site (http://www.ife.ee.ethz.ch/~cottet/publications.html): More
Experimental Analysis of Design Options for Spiral.. - Didier Cottet Janusz (2001) (Correct)
Distributed Elements and MM-Wave Characterization of Low.. - Grzyb, Cottet, Tröster (2001) (Correct)
High-Level Area and Performance Estimation of.. - Enzler, Jeger.. (2000) (Correct)
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