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Abstract: The scalability and performance of multicomputer networks benefit from packaging schemes that distribute computing resources and interconnect uniformly in three-dimensional space. Backplane -based packaging techniques using multichip modules (MCMs) and printed circuit boards (PCBs) are inefficient for three-dimensional scaling of processor arrays because they provide high-density interconnects in only two physical dimensions. Techniques for stacking MCMs can provide higher wirability in the... (Update)
Context of citations to this paper: More
.... the image processing field and fine grain, message passing MPPs employing a high communications, low memory(HCLM) execution model [8, 15 17]. Our studies have resulted in valuable insight into the performance interplay of these MPPs and have aided us in identifying the...
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BibTeX entry: (Update)
W. S. Lacy, J. L. Cruz-Rivera, and D. S. Wills, "The Offset Cube: A three-dimensional multicomputer network topology using through-wafer optics, " IEEE Trans. Parallel Dist. Syst., Jan. 1996. Submitted. http://citeseer.ist.psu.edu/lacy96offset.html More
@article{ lacy98offset,
author = "W. S. Lacy and J. L. Cruz-Rivera and D. S. Wills",
title = "The Offset Cube: {A} Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics",
journal = "IEEE Transactions on Parallel and Distributed Systems",
volume = "9",
number = "9",
pages = "893--??",
year = "1998",
url = "citeseer.ist.psu.edu/lacy96offset.html" }
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Documents on the same site (http://www.ece.uprm.edu/~jcruz/research.htm): More
The Offset Cube: An Optoelectronic Interconnection Network - Scott Wills (1994) (Correct)
Processing Architectures for Smart Pixel Systems - Scott Wills (1996) (Correct)
Modeling the Technology Impact on the Design of a Two-Level.. - Cruz-Rivera (1997) (Correct)
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