Mike Chou and Jacob White. Multilevel integral equation methods for the extraction of substrate coupling parameters in mixed-signal ic's. In #### ACM/IEEE Design Automation Conference, pages 20--25, June 1998. Home/Search Document Details and Download
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A Benchmark Suite for Substrate Analysis - Charbon, Silveira, Miliozzi (Correct)
....in the matrix, hence standard Singular Value Decomposition (SVD) techniques can be used to represent it. If the SVD of the matrix is used, vector matrix multiplications can be performed more efficiently, thus resulting in a overall complexity of O(n log n) In another, more recent approach [15], the space is first discretized using a coarser, uniform set of panels, which is in turn partitioned into smaller panels. Then, a two grid method (TGM) is applied to these two discretizations, iteratively, until either the finest possible discretization is reached or a certain tolerance on the ....
M. Chou and J. White, "Multilevel integral equation methods for the extraction of substrate coupling parameters in mixed-signal IC's", in Proc. IEEE/ACM Design Automation Conference, pp. 20--25, June 1998.
Efficient Techniques for Accurate Extraction and Modeling.. - Costa, Chou, Silveira (1999) (1 citation) Self-citation (Chou) (Correct)
....over the cell. Theoretically, the choice of s, the cell discretization parameter, has negligible effect on accuracy. Higher accuracy can be obtained by using higher order nearest neighbor cells in the exact computation or by refining the projection scheme, similarly to what is suggested in [19] in a different context. 4 Complexity Comparison In this section we compare the efficiency of the proposed precorrected DCT accelerated algorithm with the Green s function method (i.e. direct computation of Z p and solution of (1) using GMRES) as well as the unaccelerated eigendecomposition ....
....speedup provided by the proposed technique. For an example problem with 52 contacts on a 256 m Theta 256 m substrate [12] three different extractions were performed using different substrate profiles. The profiles used here were taken from [20] and have also been used elsewhere as benchmarks [11, 19]. The vertical substrate profiles are shown in Figure 3 and correspond respectively to technologies with single layer, high resistivity and low resistivity substrates with grounded backplanes. An extraction was also performed using a floating single layer substrate. Table 1 shows the relevant ....
Mike Chou and Jacob White. Multilevel integral equation methods for the extraction of substrate coupling parameters in mixed-signal ic's. In 35 th ACM/IEEE Design Automation Conference, pages 20-- 25, June 1998.
Multigrid-Based Substrate Coupling Model Extraction - Silva, Silveira (2004) (Correct)
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Mike Chou and Jacob White. Multilevel integral equation methods for the extraction of substrate coupling parameters in mixed-signal ic's. In #### ACM/IEEE Design Automation Conference, pages 20--25, June 1998.
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