M.R. Singh, C.T. Abraham and R. Akella, A Wafer Design Problem in Semiconductor manufacturing for Reliable Customer Service, IEEE Transactions on Components, Hybrids and Manufacturing Technology 13 (1990) 103--108. Home/Search Document Not in Database Summary Related Articles Check |
This paper is cited in the following contexts:
On Stochastic Integer Programming under.. - Dentcheva.. (1998) (Correct)
....while is not, has been considered in [29] Recently, in [22] a cutting plane method for solving (1.1) has been presented. Even though the literature for handling probabilistic constraints with discrete random variables is scarce, the number of potential applications is large. Singh at al.in [27] consider a microelectronic wafer design problem that arises in semiconductor manufacturing. The problem was to maximize the probability rather than to optimize an objective function subject to a probabilistic constraint, but other formulations are possible as well. Another application area are ....
M.R. Singh, C.T. Abraham and R. Akella, A Wafer Design Problem in Semiconductor manufacturing for Reliable Customer Service, IEEE Transactions on Components, Hybrids and Manufacturing Technology 13 (1990) 103--108.
On Stochastic Integer Programming under Probabilistic Constraints - Dentcheva, al. (1998) (Correct)
....while is not, has been considered in [29] Recently, in [22] a cutting plane method for solving (1) has been presented. Even though the literature for handling probabilistic constraints with discrete random variables is scarce, the number of potential applications is large. Singh at al.in [27] consider a microelectronic wafer design problem that arises in semiconductor manufacturing. The problem was to maximize the probability rather than to optimize an objective function subject to a probabilistic constraint, but other formulations are possible as well. Another application area are ....
M.R. Singh, C.T. Abraham and R. Akella, A Wafer Design Problem in Semiconductor manufacturing for Reliable Customer Service, IEEE Transactions on Components, Hybrids and Manufacturing Technology 13 (1990) 103--108.
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