| Klein, K., Koetzle, G., Miersch, E. F., Schettler, H., Schulz, U., and Wagner, O. Characteristics of a Set of 12.7mm Processor Chips. IEEE Journal of Solid State Circuits (October 1987), 783--789. Processor, VLSI. |
....process feature size, number and type of interconnect layers has also been characterized [6] 43] 57] Separately, both industrial and academic teams have detailed their experiences and tradeoff choices for the physical design of a wide selection of designs. 7] 17] 23] 26] 37] 40] 58] 61] [63] [65] Finally, several studies have been performed to quantify the human effort costs of various chip implementation flows [34] 35] 36] While this thesis draws from the collective experience of past work, it differs from past work primarily in three important points. First, this work focuses ....
Klein, K., Koetzle, G., Miersch, E. F., Schettler, H., Schulz, U., and Wagner, O. Characteristics of a Set of 12.7mm Processor Chips. IEEE Journal of Solid State Circuits (October 1987), 783--789. Processor, VLSI.
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