Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994. Home/Search Document Not in Database Summary Related Articles Check |
This paper is cited in the following contexts:
Multilevel Integral Equation Methods for the Extraction of.. - Chou, White (1998) (2 citations) (Correct)
....analog circuitry through the body effect. Since the bulk substrate behaves resistively up to a frequency of a few gigahertz [6] 23] it is sufficient to solve Laplace s equation inside the substrate with proper boundary and interface conditions. Examples of this approach [11] 22] 13] [20], 25] includes Finite Element (FEM) and Finite Difference (FD) methods. Although the resulting linear systems are sparse, such methods are impractical for complex layouts because the number of unknowns resulting from three dimensional volume meshing of the entire substrate is too large. Integral ....
B.R. Stanisic, N.K. Verghese, R.A. Rutenbar, L.R. Carley, and D.J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution synthesis. IEEEJSSC, 29(3):226--238, March 1994.
Placement of Substrate Contacts to Minimize.. - Secareanu, Warner.. (2001) (Correct)
....Key Words: substrate contacts, subtrate noise, mixed signal, epitaxial and non epitaxial technologies I. Introduction Substrate noise can affect the integrity of on chip analog and digital signals. Substrate noise in analog applications has received a great deal of attention in the past decade [1 6], particularly driven by the high resolution analog signal processing circuits operating in a noisy mixed signal environment such as in analog to digital (A D) or digital to analog (D A) converters. Substrate noise in digital applications has received far less attention because digital circuits ....
.... digital system (digital circuits exhibit a noise margin) A deleterious amount of substrate noise, however, can be exceeded in certain applications, such as in mixed signal smart power circuits [7,8] Different aspects related to the substrate noise problem have been analyzed in the literature [1 6]. The flow of substrate noise into the substrate has been qualitatively described by Wooley [1] The magnitude of the substrate noise together with related nonuniformities within the substrate have been shown to be the two primary factors that influence the noise behavior of digital circuits ....
Stanisic, B. R., Verghese, N. K. and Allstot, D. J., "Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution synthesis." IEEE Journal of Solid-State Circuits 29(3), pp. 226--238, March 1994.
Physical Design to Improve the Noise Immunity of.. - Secareanu.. (Correct)
....are presented to improvethenoise immunity of digital circuits in smart pow er systems. I. Introduction Existing research in substrate coupling noise in mixedsignal circuits has concen tratedon the problem of the high speed digital circuitry influencing the highly sensitive analog circuitry [1 6]. It has been demonstrated in the literature that physical design plays an important role in minimizing the influence of substrate noise generated by the digital circuitry, affecting the highly sensitiveanalog circuitry [1 6] A number of articles [1 5] have reported experimentally observed ....
.... digital circuitry influencing the highly sensitive analog circuitry [1 6] It has been demonstrated in the literature that physical design plays an important role in minimizing the influence of substrate noise generated by the digital circuitry, affecting the highly sensitiveanalog circuitry [1 6]. A number of articles [1 5] have reported experimentally observed noise waveforms caused by the high speed switc hing of the on chip digital CMOS circuits in mixedsignal systems. Atypical noise w aveform,bothexperimentally observed and simulated, is shown in Fig. 1. Note that the noise spikes ....
[Article contains additional citation context not shown here]
B. R. Stanisic, N. K. Verghese, and D. J. Allstot, "Addressing Substrate Coupling in Mixed-Mode IC's: Sim ulation and P ower Distribution Synthesis," IEEE Journal of Solid-State Cir cuits,Vol. 29, No. 3, pp. 226--238, March 1994.
Multilevel Integral Equation Methods for the Extraction of.. - Chou, White (1998) (2 citations) (Correct)
....analog circuitry through the body effect. Since the bulk substrate behaves resistively up to a frequency of a few gigahertz [6] 23] it is sufficient to solve Laplace s equation inside the substrate with proper boundary and interface conditions. Examples of this approach [11] 22] 13] [20], 25] includes Finite Element (FEM) and Finite Difference (FD) methods. Although the resulting linear systems are sparse, such methods are impractical for complex layouts because the number of unknowns resulting from three dimensional volume meshing of the entire substrate is too large. Integral ....
B.R. Stanisic, N.K. Verghese, R.A. Rutenbar, L.R. Carley, and D.J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution synthesis. IEEEJSSC, 29(3):226--238, March 1994.
Efficient Techniques for Accurate Extraction and Modeling.. - Costa, Chou, Silveira (1999) (1 citation) (Correct)
....[3, 5] Thus, in order to model coupling effects, it is sufficient to solve Laplace s equation inside the substrate with appropriate boundary and interface conditions. Many techniques have been used to solve this problem, including Finite Element (FEM) and Finite Difference (FD) methods [2, 6, 7, 8]. However, for complex layouts the number of unknowns resulting from the discretization of the three dimensional substrate volume may become too large for practical purposes. Boundary Element methods (BEM) are very appealing for the solution of this type of problems because the size of the matrix ....
Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994.
Efficient Techniques for Accurate Modeling and Simulation.. - Costa, Chou, Silveira (1998) (3 citations) (Correct)
....of the substrate electromagnetic interactions which rely on detailed numerical analysis are in general more reliable and accurate. Examples of 3D techniques include Finite Element (FEM) and Finite Diference (FD) numerical methods for computing all the currents and voltages in the substrate [2, 3, 4, 5, 6]. These techniques perform a full domain discretization on the large but bounded substrate and can easily handle irregular substrates (wells, doping profiles, etc) Unfortunately such methods are impractical for anything but simple problems, since the number of unknowns resulting from the ....
Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994.
Multilevel Integral Equation Methods for the Extraction of.. - Mike Chou (1998) (2 citations) (Correct)
....analog circuitry through the body effect. Since the bulk substrate behaves resistively up to a frequency of a few gigahertz [6] 23] it is sufficient to solve Laplace s equation inside the substrate with proper boundary and interface conditions. Examples of this approach [11] 22] 13] [20], 25] includes Finite Element (FEM) and Finite Difference (FD) methods. Although the resulting linear systems are sparse, such methods are impractical for complex layouts because the number of unknowns resulting from three dimensional volume meshing of the entire substrate is too large. Integral ....
B.R. Stanisic, N.K. Verghese, R.A. Rutenbar, L.R. Carley, and D.J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution synthesis. IEEEJSSC, 29(3):226--238, March 1994.
Efficient Techniques for Accurate Modeling and Simulation.. - Costa, Chou, Silveira (1998) (3 citations) (Correct)
....[4] Several approaches have been presented in the past to attempt to quantify the effects of noise coupling through the substrate. Examples of such techniques include Finite Element (FEM) and Finite Diference (FD) numerical methods for computing all the currents and voltages in the substrate [1, 2, 5, 6, 7]. Unfortunately such methods are impractical for anything but simple problems, since the number of unknowns resulting from the discretization is too large because of volume meshing of the entire substrate. Device simulators such as MEDICI and PISCES can also be used for this task. However they are ....
Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994.
Issues in Parallelizing Multigrid-Based Substrate Model - Jo Ao Silva (Correct)
No context found.
Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994.
Efficient Techniques for Accurate Modeling and Simulation of.. - Jo Ao Paulo (1998) (Correct)
No context found.
Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994.
Multigrid-Based Substrate Coupling Model Extraction - Silva, Silveira (2004) (Correct)
No context found.
Balsha Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley, and David J. Allstot. Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution systems. IEEE Journal of Solid-State Circuits, 29(3):226--237, March 1994.
Analysis and Optimization of Structured Power/Ground Networks - Su, Gala, al. (Correct)
No context found.
B. R. Stanisic, N. K. Verghese, R. A. Rutenbar, L. R. Carley, and D. J. Allstot. Addressing Substrate Coupling in Mixed-mode IC's: Simulation and Power Distribution Synthesis. IEEE Journal of Solid-State Circuits, 29:226--238, March 1994.
SuPREME: Substrate and Power-delivery Reluctance-Enhanced.. - Chen, Luk, Chen (2003) (Correct)
No context found.
B. R. Stanisic, N. K. Verghese, R. A. Rutenbar, L. R. Carley, and D. J. Allstot. Addressing substrate coupling in mixed-mode ic's simulation and power distribution synthesis. IEEE Journal of Solid-State Circuits, 29(3), March 1994.
Fast Analysis and Optimization of Power/Ground Networks - Haihua Su Kaushik (2000) (2 citations) (Correct)
No context found.
B. R. Stanisic, N. K. Verghese, R. A. Rutenbar, L. R. Carley, and D. J. Allstot, "Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution synthesis," IEEE Journal of Solid-State Circuits, vol. 29, pp. 226-238, Mar. 1994.
An Substrate Noise Circuit for Accurately Testing Mixed-Signal.. - Weize Xu And (Correct)
No context found.
B. R. Stanisic, N. K. Verghese, R. A. Rutenbar, L. R. CarIcy, and D. J. Allstot, "Addressing Substrate Coupling in Mixed-Mode IC's: Simulation and Power Distribution Synthesis," IEEE Journal of Solid-State Circuits, Vol. 29, No. 3, pp. 226-237, March 1994.
Analysis and Optimization of Structured Power/Ground Networks - Su, Gala, Sapatnekar (Correct)
No context found.
B. R. Stanisic, N. K. Verghese, R. A. Rutenbar, L. R. Carley, and D. J. Allstot, "Addressing substrate coupling in mixed-mode IC's: Simulation and power distribution synthesis," IEEE Journal of Solid-State Circuits, vol. 29, pp. 226-238, Mar. 1994. 14
Fast Analysis and Optimization of Power/Ground Networks - Tw Or Ks (2000) (Correct)
No context found.
B. R. Stanisic, N. K. Verghese, R. A. Rutenbar, L. R. Carley, and D. J. Allstot, "Addressing substrate coupling in mixedmode IC's: Simulation and power distribution synthesis," IEEE Journal of Solid-State Circuits, vol. 29, pp. 226-238, Mar. 1994.
Hardware Learning in Analogue VLSI Neural Networks - Lehmann (1994) (4 citations) (Correct)
No context found.
Balsha R. Stanisic, Nishath K. Verghese, Rob A. Rutenbar, L. Richard Carley and David J. Allstot, "Addressing Substrate Coupling in Mixed-Mode IC's: Simulation and Power Distribution Synthesis," IEEE Journal of Solid-State Circuits, vol. SC-29, no. 3, pp. 226--238, 1994.
Online articles have much greater impact More about CiteSeer.IST Add search form to your site Submit documents Feedback
CiteSeer.IST - Copyright Penn State and NEC