Lau JH, Pao Y-H (1996) Solder joint reliability of BGA, CSP, flip-chip, and fine pitch SMT assemblies. McGraw-Hill, New York Home/Search Document Not in Database Summary Related Articles Check |
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DOI 10.1007/s00170-004-2181-9 - Original Article Int (Correct)
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Lau JH, Pao Y-H (1996) Solder joint reliability of BGA, CSP, flip-chip, and fine pitch SMT assemblies. McGraw-Hill, New York
Str/03/011/jt - Meso- Micro-Scale Testing (Correct)
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J.H. Lau and Y.H. Pao, Solder joint reliability of BGA, flip chip, CSP, and fine pitch SMT assemblies, New York, Van Nostrand Reinhold, (1997).
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