T. Swirbel, A. Naujoks, M. Watkins, "Electrical design and simulation of high density printed circuit boards", in Proc. Electronic Components and Technology Conference (ECTC'99), San Diego, USA, pp. 794-799, June 1-4, 1999. Home/Search Document Not in Database Summary Related Articles |
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The Impact of Low Cost High Density Substrates on RF.. - Cottet Grzyb Trster (2000) (Correct)
....or analogue signals requires transmission line structures with controlled impedance (microstrips, triplates and coplanar waveguides) to ensure signal integrity and loss free signal propagation. Extensive investigations of parameter variations in transmission lines structures have been published in [5]. The light shaded area of Figure 4 shows the impedance accuracy of a 50 W microstrip line, considering the metallisation tolerances (worst case: 5.1 m 1.9 m) and the dielectric deposition tolerances (3 layers, worst case: 2 m) of the LAP process. Full process characterisation and process ....
T. Swirbel, A. Naujoks, M. Watkins, "Electrical design and simulation of high density printed circuit boards", in Proc. Electronic Components and Technology Conference (ECTC'99), San Diego, USA, pp. 794-799, June 1-4, 1999.
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