P. Chiniwalla, "Multilayer planarization of polymer dielectrics," in Proc. Int. Conf. on High Dens. Packag. and MCMs, (Denver,USA), pp. 52--57, April 6-9 1999. Home/Search Document Not in Database Summary Related Articles Check |
This paper is cited in the following contexts:
MM-Wave Integrated Antennas on Low Cost MCM-D Substrates - Janusz Grzyb Didier (2000) (Correct)
....concentration. This uniformity is also an issue for electroplating, because it is as well a chemical process. But the plating process is much faster (10 100 x) so local thickness variations and across panel nonuniformity are even higher. Dielectrics The actual DOP (Degree of Planarisation) [3] level of BCB and PBO, after cross sectioned our test vehicles, was in the range of for both materials. The overall thickness variations of spin coated BCB and PBO on planarised surface is for nominal thicknesses of and for BCB and PBO, respectively. With the Rogers 4003 laminate as a base ....
P. Chiniwalla, "Multilayer planarization of polymer dielectrics," in Proc. Int. Conf. on High Dens. Packag. and MCMs, (Denver,USA), pp. 52--57, April 6-9 1999.
The Impact of Low Cost High Density Substrates on RF.. - Cottet Grzyb Trster (2000) (Correct)
....deposition Ideal dielectric deposition would provide 100 planarisation from one layer to the other but in common thin film technologies this is never achieved. The degree of planarisation (DOP) was therefore first introduced in [3] to quantify this effect and extended for multilayer build ups in [4]. We have cross sectioned LAP test substrates to measure the planarisation of BCB and PBO on copper conductors. A DOP of about 55 was observed for both materials (Figure 2a and b) The overall thickness variation of spin coated BCB and PBO on a planarised surface is 0.5 m for a nominal thickness ....
P. Chiniwalla et al., "Multilayer planarization of polymer dielectrics," in Proc. Int. Conf. on High Density Packaging and MCMs (MCM'99), Denver USA, pp. 52-57, April 6-9, 1999.
MM-Wave Microstrip and Novel Slot Antennas on Low Cost.. - Grzyb, Cottet, Tröster (2001) (Correct)
....As basic interconnect metal composite layer of electroplated or deposited copper (primary conductor) is used: 1.with BCB Ti W (80nm) Cu(2m) Ni (0.5m) plus Au (1m) on top layer 2. with PBO Ti (80nm) Cu(2m) plus Ni (2m) and Au (1m) on top layer The actual Degree of Planarization level (DOP) [6] of BCB and PBO, after cross sectioned our test vehicles was in the range of 60 for both dielectrics. III. Analysis, design and measurements III.A Simulation Technique Finite Element Method has been chosen as a simulation technique to calculate the full 3D EM fields with tetrahedron as a basic ....
P.Chiniwalla, "Multilayer Planarization of Polymer Dielectrics" in Proc Int. Conf. On HDI and MCMs., pp.52-57, April 6-9, 1999, Denver, USA
Distributed Elements and MM-Wave Characterization of Low.. - Grzyb, Cottet, Tröster (2001) (Correct)
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P.Chiniwalla, "Multilayer Planarization of Polymer Dielectrics" in Proc Int. Conf. On HDI and MCMs., pp.52-57, April 6-9, 1999, Denver, USA
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