"Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages," http://www.ife.ee.ethz.ch/mcm/lap, 1998. Home/Search Document Not in Database Summary Related Articles Check |
This paper is cited in the following contexts:
The Impact of Low Cost High Density Substrates on RF.. - Cottet Grzyb Trster (2000) (Correct)
....geometry. High performance MCM D technology, based on aluminium conductors and polyimide thin film on silicon substrates, is the most commonly used technology for that purpose. A new low cost alternative to this high performance technology has been developed within the EU Esprit project LAP 1 [1]. The LAP technology is a four layer thin film process based on low cost materials and cost optimised manufacturing. The substrate cost target is as low as 1 US inch 2 ( 0.15 US cm 2 ) and shall be obtained by increasing the manufacturing panel size from today s 4 4 inch 2 up to 24 24 ....
"Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages," http://www.ife.ee.ethz.ch/mcm/lap, 1998.
New Process Monitoring Strategies for Large Area Panel.. - Didier Cottet Michael (2000) (Correct)
....the area consumption, maximise the failure coverage and avoid additional process steps. A case study at the end of the paper shows the benefits in terms of yield and cost when using the new strategies. Key words: MCM D, LAP, yield, cost, process monitoring 1 Introduction The EU LAP Project [1] aims to reduce manufacturing costs of multi layer MCM D substrates. To reach the cost target of US 1 inch 2 new equipment and new materials are investigated. But the main cost reduction shall be achieved by using large area panel processing (LAP) Three manufacturers of the LAP consortium have ....
"Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages," http://www.ife.ee.ethz.ch/mcm/lap, 1998.
Experimental Analysis of Design Options for Spiral.. - Didier Cottet Janusz (2001) (Correct)
....representative examples of the design options are investigated and final conclusions are drawn. 2. LAP Technology and Performance A new process for low cost MCM D substrates was developed within the EU Esprit project LAP (Low cost Large Area Panel Processing of MCM D substrates and packages) [5]. The cost target for this four layer thin film technology is US 1 in 2 . To reach this target, the project consortium has increased the production size from today s 44in 2 and 55in 2 panels up to 1212in 2 and 2424in 2 panels. 2.1. Test Vehicles To characterize the LAP technology a set ....
"Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages," http://www.ife.ee.ethz.ch/hdp/lap, 1998.
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