Original Article Int DOI 10.1007/s00170-004-2181-9 ORIGINAL ARTICLE Int J Adv Manuf Technol (2005)...  Home/Search
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Abstract: The exponential growth of the electronics packaging industry has fueled the availability of a variety of area array packages. The reliability of these packages, as characterized by their capacity to withstand the IPC- (formerly Institute of Interconnecting and Packaging Electronic Circuits) prescribed swings in temperature, differentiates one from the other. With design cycles shrinking and competition surging, the capability to make instant package selection decisions by leveraging prior... (Update)
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BibTeX entry: (Update)
@misc{ int-doi,
author = "Original Article Int",
title = "DOI 10.1007/s00170-004-2181-9",
url = "citeseer.ist.psu.edu/726617.html" }
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